Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
WIRING SUBSTRATE, COMPOSITE SUBSTRATE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE
A wiring substrate includes a ceramic substrate having an upper surface, a lower surface, and a lateral surface. The lower surface includes a first lower surface and a second lower surface inward from the first lower surface. The lateral surface includes a first lateral surface and a second lateral surface inward from the first lateral surface. The wiring substrate includes a first wiring having a thickness of 80% or more of a height from the second lower surface to the first lower surface and disposed in contact with the second lower surface and the second lateral surface. A lateral surface of the first wiring is exposed from the first lateral surface. A main surface of 50% or more of a surface area of a lower surface of the first wiring is substantially parallel to the second lower surface and is disposed inward from the first lower surface.
WIRING SUBSTRATE, COMPOSITE SUBSTRATE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE
A wiring substrate includes a ceramic substrate having an upper surface, a lower surface, and a lateral surface. The lower surface includes a first lower surface and a second lower surface inward from the first lower surface. The lateral surface includes a first lateral surface and a second lateral surface inward from the first lateral surface. The wiring substrate includes a first wiring having a thickness of 80% or more of a height from the second lower surface to the first lower surface and disposed in contact with the second lower surface and the second lateral surface. A lateral surface of the first wiring is exposed from the first lateral surface. A main surface of 50% or more of a surface area of a lower surface of the first wiring is substantially parallel to the second lower surface and is disposed inward from the first lower surface.
WIRING SUBSTRATE, COMPOSITE SUBSTRATE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE
MINATO EIKO (Autor:in) / HOSOKAWA ATSUSHI (Autor:in) / NAGAE AKIKO (Autor:in) / KAWAMATA TAKASHI (Autor:in)
20.03.2025
Patent
Elektronische Ressource
Englisch
WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SAME
| Europäisches Patentamt | 2019
Wiring substrate, multi-piece wiring substrate, and method for manufacturing same
| Europäisches Patentamt | 2016
Europäisches Patentamt | 2020
| Europäisches Patentamt | 2016