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    Composition for forming aluminum-containing film, and method for forming aluminum-containing film

    Neue Suche nach: NAKAGAWA HISASHI
    Neue Suche nach: SAKAI TATSUYA

    A composition for forming an aluminum-containing film includes an organic solvent, and an organic aluminum compound. The organic aluminum compound has a structure represented by a general formula (1). In the general formula (1), each of R1 to R6 is independently a hydrogen atom or a hydrocarbon group, each of R1s, R2s, R3s, R4s, R5s and R6s is identical or different, and optionally each of R1s, R2s, R3s, R4s, R5s or R6s is linked to one another.

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    Composition for forming aluminum-containing film, and method for forming aluminum-containing film

    Neue Suche nach: NAKAGAWA HISASHI
    Neue Suche nach: SAKAI TATSUYA

    A composition for forming an aluminum-containing film includes an organic solvent, and an organic aluminum compound. The organic aluminum compound has a structure represented by a general formula (1). In the general formula (1), each of R1 to R6 is independently a hydrogen atom or a hydrocarbon group, each of R1s, R2s, R3s, R4s, R5s and R6s is identical or different, and optionally each of R1s, R2s, R3s, R4s, R5s or R6s is linked to one another.

    Zugriff

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    Composition for forming aluminum-containing film, and method for forming aluminum-containing film

    Neue Suche nach: NAKAGAWA HISASHI
    Neue Suche nach: SAKAI TATSUYA

    A composition for forming an aluminum-containing film includes an organic solvent, and an organic aluminum compound. The organic aluminum compound has a structure represented by a general formula (1). In the general formula (1), each of R1 to R6 is independently a hydrogen atom or a hydrocarbon group, each of R1s, R2s, R3s, R4s, R5s and R6s is identical or different, and optionally each of R1s, R2s, R3s, R4s, R5s or R6s is linked to one another.

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    Titel:

    Composition for forming aluminum-containing film, and method for forming aluminum-containing film

    Beteiligte:

    NAKAGAWA HISASHI (Autor:in) / SAKAI TATSUYA (Autor:in)

    Erscheinungsdatum:

    14.07.2015

    Medientyp:

    Patent

    Format:

    Elektronische Ressource

    Sprache:

    Englisch

    Klassifikation:

    IPC:  C09D Überzugsmittel, z.B. Anstrichstoffe, Firnisse oder Lacke , COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS / C04B Kalk , LIME / C23C Beschichten metallischer Werkstoffe , COATING METALLIC MATERIAL / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES

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