Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Insulation material for integrated circuits and use of said integrated circuits
The invention relates to the fields of microelectronics and materials sciences and concerns an insulation layer material for integrated circuits in microelectronics, which can be used, for example, in integrated circuits as insulation material in semiconductor components. The object of the present invention is to disclose an insulation material for integrated circuits, which has dielectric constants of k≰2 with good mechanical properties at the same time. The object is attained with an insulation material for integrated circuits, containing at least MOFs and/or COFs.
Insulation material for integrated circuits and use of said integrated circuits
The invention relates to the fields of microelectronics and materials sciences and concerns an insulation layer material for integrated circuits in microelectronics, which can be used, for example, in integrated circuits as insulation material in semiconductor components. The object of the present invention is to disclose an insulation material for integrated circuits, which has dielectric constants of k≰2 with good mechanical properties at the same time. The object is attained with an insulation material for integrated circuits, containing at least MOFs and/or COFs.
Insulation material for integrated circuits and use of said integrated circuits
SEIFERT GOTTHART (Autor:in) / HERMANN HELMUT (Autor:in) / ZAGORODNIY KONSTYANTYN (Autor:in) / ZSCHECH EHRENFRIED (Autor:in)
25.08.2015
Patent
Elektronische Ressource
Englisch
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