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Cutting tool insert
A polycrystalline diamond (PCD) compact and method for making the compact are provided. The method includes bringing a first PCD wafer and a second PCD wafer together at an interface in the presence of a bonding agent to form an unbonded assembly and bonding the wafers together at the interface at a pressure and temperature at which diamond is thermodynamically stable. The first PCD wafer is more thermally stable than the second PCD wafer.
Cutting tool insert
A polycrystalline diamond (PCD) compact and method for making the compact are provided. The method includes bringing a first PCD wafer and a second PCD wafer together at an interface in the presence of a bonding agent to form an unbonded assembly and bonding the wafers together at the interface at a pressure and temperature at which diamond is thermodynamically stable. The first PCD wafer is more thermally stable than the second PCD wafer.
Cutting tool insert
LIVERSAGE JOHN HEWITT (Autor:in) / GOUDEMOND IAIN PATRICK (Autor:in) / SCOTT DANNY EUGENE (Autor:in)
09.02.2016
Patent
Elektronische Ressource
Englisch
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
B01J
Chemische oder physikalische Verfahren, z.B. Katalyse oder Kolloidchemie
,
CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY
/
B22F
Verarbeiten von Metallpulver
,
WORKING METALLIC POWDER
/
B29C
Formen oder Verbinden von Kunststoffen
,
SHAPING OR JOINING OF PLASTICS
/
C04B
Kalk
,
LIME
/
C22C
Legierungen
,
ALLOYS