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Surface-decorated polymeric amphiphile porogens for the templation of a nanoporous materials
A nanoparticle which includes a multi-armed core and surface decoration which is attached to the core is prepared. A multi-armed core is provided by any of a number of possible routes, exemplary preferred routes being living anionic polymerization that is initiated by a reactive, functionalized anionic initiator and ∈-caprolactone polymerization of a bis-MPA dendrimer. The multi-armed core is preferably functionalized on some or all arms. A coupling reaction is then employed to bond surface decoration to one or more arms of the multi-armed core. The surface decoration is a small molecule or oligomer with a degree of polymerization less than 50, a preferred decoration being a PEG oligomer with degree of polymerization between 2 and 24. The nanoparticles (particle size ≦10 nm) are employed as sacrificial templating porogens to form porous dielectrics. The porogens are mixed with matrix precursors (e.g., methyl silsesquioxane resin), the matrix vitrifies, and the porogens are removed via burnout. Greater porosity reduces the dielectric constant k of the resulting dielectrics. The porous dielectrics are incorporated into integrated circuits as lower k alternatives to silicon dioxide.
Surface-decorated polymeric amphiphile porogens for the templation of a nanoporous materials
A nanoparticle which includes a multi-armed core and surface decoration which is attached to the core is prepared. A multi-armed core is provided by any of a number of possible routes, exemplary preferred routes being living anionic polymerization that is initiated by a reactive, functionalized anionic initiator and ∈-caprolactone polymerization of a bis-MPA dendrimer. The multi-armed core is preferably functionalized on some or all arms. A coupling reaction is then employed to bond surface decoration to one or more arms of the multi-armed core. The surface decoration is a small molecule or oligomer with a degree of polymerization less than 50, a preferred decoration being a PEG oligomer with degree of polymerization between 2 and 24. The nanoparticles (particle size ≦10 nm) are employed as sacrificial templating porogens to form porous dielectrics. The porogens are mixed with matrix precursors (e.g., methyl silsesquioxane resin), the matrix vitrifies, and the porogens are removed via burnout. Greater porosity reduces the dielectric constant k of the resulting dielectrics. The porous dielectrics are incorporated into integrated circuits as lower k alternatives to silicon dioxide.
Surface-decorated polymeric amphiphile porogens for the templation of a nanoporous materials
HEDRICK JAMES LUPTON (Autor:in) / LEE VICTOR YEE-WAY (Autor:in) / MAGBITANG TEDDIE PEREGRINO (Autor:in) / MILLER ROBERT DENNIS (Autor:in)
21.02.2017
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
/
C08F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, erhalten durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
C08G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, anders erhalten als durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
H01L
Halbleiterbauelemente
,
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