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Vibration damping floor system
A floor is disclosed having an upper contact surface disposed atop an upper subfloor, the upper subfloor having a void with a height that is defined by opposing sidewalls of the first subfloor, a top that is defined by a bottom surface of the upper contact surface, a bottom that is defined by a top surface of a lower subfloor, a width, and a length. A first resilient pad is disposed under compression within the void of the upper subfloor. The lower subfloor is disposed beneath and in contact with the upper subfloor. The lower subfloor has a void that is laterally offset from the void of the upper subfloor and a second resilient pad disposed within the void. A plurality of removable force transfer members are disposed within the void of the lower subfloor and above the second resilient pad for transferring vibrational forces and downward vertical forces to the second resilient pad.
Vibration damping floor system
A floor is disclosed having an upper contact surface disposed atop an upper subfloor, the upper subfloor having a void with a height that is defined by opposing sidewalls of the first subfloor, a top that is defined by a bottom surface of the upper contact surface, a bottom that is defined by a top surface of a lower subfloor, a width, and a length. A first resilient pad is disposed under compression within the void of the upper subfloor. The lower subfloor is disposed beneath and in contact with the upper subfloor. The lower subfloor has a void that is laterally offset from the void of the upper subfloor and a second resilient pad disposed within the void. A plurality of removable force transfer members are disposed within the void of the lower subfloor and above the second resilient pad for transferring vibrational forces and downward vertical forces to the second resilient pad.
Vibration damping floor system
RANDJELOVIC ERLIN A (Autor:in)
31.10.2017
Patent
Elektronische Ressource
Englisch
VIBRATION DAMPING DEVICE FOR FLOOR AND VIBRATION ISOLATION FLOOR STRUCTURE
Europäisches Patentamt | 2018
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