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CARD-TYPE SMART KEY AND MANUFACTURING METHOD THEREFOR
The present invention relates to a card-type smart key comprising: a PCB substrate on which components are mounted; and an EMC case which is coupled to the component mounting surface of the PCB substrate, wherein the EMC case is formed by: fixing the component non-mounting surface of the PCB substrate onto a lower plate of a mold after bringing the component non-mounting surface into close contact with the lower plate; covering the component mounting surface of the PCB substrate with an upper plate of the mold, leaving a preset space; and inputting a molding material into the preset space.
La présente invention concerne une clef intelligente de type carte qui comprend : un substrat de PCB sur lequel des composants sont montés ; et un boîtier CEM qui est couplé à la surface de montage de composants du substrat de PCB, le boîtier CEM étant formé : en fixant la surface de non-montage de composant du substrat de PCB sur une plaque inférieure d'un moule après avoir mis la surface de non-montage de composant en contact intime avec la plaque inférieure ; en couvrant la surface de montage de composants du substrat de PCB avec une plaque supérieure du moule, laissant un espace prédéterminé ; et en entrant un matériau de moulage dans l'espace prédéterminé.
본 발명은 부품이 실장되는 PCB 기판, 상기 PCB 기판의 부품 실장면에 결합되는 EMC 케이스를 포함하고, 상기 EMC 케이스는 상기 PCB 기판의 부품 비실장면을 금형 하판에 밀착시켜 고정하고, 상기 PCB 기판의 부품 실장면 위에 기 설정된 공간을 두고 금형 상판을 덮어, 상기 기 설정된 공간에 성형 재료를 투입하여 형성하는 것을 특징으로 하는 카드형 스마트키에 관한 것이다.
CARD-TYPE SMART KEY AND MANUFACTURING METHOD THEREFOR
The present invention relates to a card-type smart key comprising: a PCB substrate on which components are mounted; and an EMC case which is coupled to the component mounting surface of the PCB substrate, wherein the EMC case is formed by: fixing the component non-mounting surface of the PCB substrate onto a lower plate of a mold after bringing the component non-mounting surface into close contact with the lower plate; covering the component mounting surface of the PCB substrate with an upper plate of the mold, leaving a preset space; and inputting a molding material into the preset space.
La présente invention concerne une clef intelligente de type carte qui comprend : un substrat de PCB sur lequel des composants sont montés ; et un boîtier CEM qui est couplé à la surface de montage de composants du substrat de PCB, le boîtier CEM étant formé : en fixant la surface de non-montage de composant du substrat de PCB sur une plaque inférieure d'un moule après avoir mis la surface de non-montage de composant en contact intime avec la plaque inférieure ; en couvrant la surface de montage de composants du substrat de PCB avec une plaque supérieure du moule, laissant un espace prédéterminé ; et en entrant un matériau de moulage dans l'espace prédéterminé.
본 발명은 부품이 실장되는 PCB 기판, 상기 PCB 기판의 부품 실장면에 결합되는 EMC 케이스를 포함하고, 상기 EMC 케이스는 상기 PCB 기판의 부품 비실장면을 금형 하판에 밀착시켜 고정하고, 상기 PCB 기판의 부품 실장면 위에 기 설정된 공간을 두고 금형 상판을 덮어, 상기 기 설정된 공간에 성형 재료를 투입하여 형성하는 것을 특징으로 하는 카드형 스마트키에 관한 것이다.
CARD-TYPE SMART KEY AND MANUFACTURING METHOD THEREFOR
CLEF INTELLIGENT DE TYPE CARTE ET SON PROCÉDÉ DE FABRICATION
카드형 스마트키 및 그 제조 방법
KIM HA GYUEN (Autor:in) / JANG KYUNG SIM (Autor:in) / NA HYEONG JOONG (Autor:in) / PARK SEONG JUN (Autor:in) / YOON JEONG JU (Autor:in) / KIM DAE HO (Autor:in)
08.12.2016
Patent
Elektronische Ressource
Koreanisch
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