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Cost effective process for high-efficiency solar cells
A new method for patterning the rear passivation layers of high-efficiency solar cells with a mechanical scriber has been developed and successfully adapted to fabricate high-efficiency passivated emitter and rear cell (PERC). Three types of the rear contact patterns: dot patterns with a photolithography process, line and dashed line patterns with a mechanical scriber process have been processed in order to optimize the rear contact structure. An efficiency of 19.42% has been achieved on the mechanicalscribed (MS)-PERC solar cell on 0.5Ωcm p-type FZ-Si wafer and is comparable to that of conventional PERC solar cells fabricated by using photolithography process. The mechanical scriber process shows great potential for commercial applications by achieving high efficiency above 20% and by significantly reducing the fabrication costs without an expensive photolithography process. Low cost Ni/Cu metal contact has been formed by using a low cost electroless and electroplating. Nickel silicide formation at the interface enhances stability and reduces the contact resistance resulting in an energy conversion efficiency of 20.2 % on 0.5 Ωcm FZ wafer
Cost effective process for high-efficiency solar cells
A new method for patterning the rear passivation layers of high-efficiency solar cells with a mechanical scriber has been developed and successfully adapted to fabricate high-efficiency passivated emitter and rear cell (PERC). Three types of the rear contact patterns: dot patterns with a photolithography process, line and dashed line patterns with a mechanical scriber process have been processed in order to optimize the rear contact structure. An efficiency of 19.42% has been achieved on the mechanicalscribed (MS)-PERC solar cell on 0.5Ωcm p-type FZ-Si wafer and is comparable to that of conventional PERC solar cells fabricated by using photolithography process. The mechanical scriber process shows great potential for commercial applications by achieving high efficiency above 20% and by significantly reducing the fabrication costs without an expensive photolithography process. Low cost Ni/Cu metal contact has been formed by using a low cost electroless and electroplating. Nickel silicide formation at the interface enhances stability and reduces the contact resistance resulting in an energy conversion efficiency of 20.2 % on 0.5 Ωcm FZ wafer
Cost effective process for high-efficiency solar cells
S. H. Lee, (Autor:in)
01.10.2006
385049 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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