Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
TECHNICAL PAPERS - Adhesive Contact between a Rigid Punch and a Half-Plane via a Thin, Soft Interlayer
TECHNICAL PAPERS - Adhesive Contact between a Rigid Punch and a Half-Plane via a Thin, Soft Interlayer
TECHNICAL PAPERS - Adhesive Contact between a Rigid Punch and a Half-Plane via a Thin, Soft Interlayer
Porter, M.I. (Autor:in) / Hills, D.A.
2001
Aufsatz (Zeitschrift)
Englisch
Micro-scale adhesive contact of a spherical rigid punch on a piezoelectric half-space
| British Library Online Contents | 2005
TECHNICAL PAPERS - Incomplete Frictional Flat-Ended Punch on Half-Plane with Edge Crack
| Online Contents | 1999
Stress state of a half-plane with cracks under rigid punch action
| British Library Online Contents | 2000
Constant motion of rigid punch over the boundary of viscoelastic half-plane
| British Library Online Contents | 2006
The solution of the contact between a tilted circular rigid punch and an elastic half-space
| British Library Online Contents | 1995