Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Interaction Between Hexagonal Wire Reinforcement and Rubber Tire Chips with and without Sand Mixture
Interaction Between Hexagonal Wire Reinforcement and Rubber Tire Chips with and without Sand Mixture
Interaction Between Hexagonal Wire Reinforcement and Rubber Tire Chips with and without Sand Mixture
Youwai, S. (Autor:in) / Bergado, D. / Supawiwat, N.
2004
Aufsatz (Zeitschrift)
Englisch
BKL:
38.58
Geomechanik
/
56.20
Ingenieurgeologie, Bodenmechanik
Lokalklassifikation TIB:
770/4815/6545
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