Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
High-Frequency EM Characterization of Through-Wall Building Imaging
High-Frequency EM Characterization of Through-Wall Building Imaging
High-Frequency EM Characterization of Through-Wall Building Imaging
Chang, P.C. (Autor:in) / Burkholder, R.J. / Volakis, J.L. / Marhefka, R.J. / Bayram, Y.
2009
Aufsatz (Zeitschrift)
Unbekannt
Lokalklassifikation TIB:
770/3710/5670
BKL:
74.41
/
38.03
Methoden und Techniken der Geowissenschaften
/
74.41
Luftaufnahmen, Photogrammetrie
/
38.03
Microwave Imaging in Frequency Domain for Through-Wall Multiple Conductors
British Library Online Contents | 2016
|Construction method for reinforcing historical building wall through high-ductility compound
Europäisches Patentamt | 2024
|Three-Dimensional Through-Wall Imaging Under Ambiguous Wall Parameters
Online Contents | 2009
|