Value-added recycling of construction waste wood into noise and thermal insulating cement-bonded particleboards: Fid-Bau Portal

Value-added recycling of construction waste wood into noise and thermal insulating cement-bonded particleboards

Wang, Lei

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Value-added recycling of construction waste wood into noise and thermal insulating cement-bonded particleboards

Wang, Lei

Value-added recycling of construction waste wood into noise and thermal insulating cement-bonded particleboards

Wang, Lei

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

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Dokumentinformationen

Titel:

Value-added recycling of construction waste wood into noise and thermal insulating cement-bonded particleboards

Beteiligte:

Wang, Lei (Autor:in) / Chen, Season S / Tsang, Daniel C.W / Poon, Chi Sun / Shih, Kaimin

Erschienen in:

Construction & building materials ; 125

Erscheinungsdatum:

2016

ISSN:

0950-0618

DOI:

https://doi.org/10.1016/j.conbuildmat.2016.08.053

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Schlagwörter:

Baukonstruktion , Baustoff

Klassifikation:

BKL: 56.45 Baustoffkunde / 56.45

Wang, Lei / Chen, Season S. / Tsang, Daniel C.W. et al. | British Library Online Contents | 2016

Value-added recycling of construction waste wood into noise and thermal insulating cement-bonded particleboards

Wang, Lei / Chen, Season S. / Tsang, Daniel C.W. et al. | Elsevier | 2016

Value-added recycling of construction waste wood into noise and thermal insulating cement-bonded particleboards

Wang, Lei / Chen, Season S. / Tsang, Daniel C.W. et al. | British Library Online Contents | 2016

Value-added recycling of construction waste wood into noise and thermal insulating cement-bonded particleboards

Wang, Lei / Chen, Season S. / Tsang, Daniel C.W. et al. | British Library Online Contents | 2016

Value-added utilization of wood processing residues into cement-bonded particleboards with admirable integrated performance

Hou, Junfeng / Jin, Yongming / Che, Wenbo et al. | Elsevier | 2022

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