Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Overview of Basic Solid–Liquid PCMs Used in Building Envelopes—Packaging Methods, Encapsulation, and Thermal Enhancement
Modern developments in areas of building technologies and new construction methods have led to reduced build time and cost for residential and commercial buildings. However, they have also resulted in lightweight construction materials with very little thermal mass. Fortunately, PCM-enhanced building components exhibit higher per unit heat storage capacity than more traditional building materials and they can bring additional thermal mass to lightweight building structures. In this chapter, an overview has been made of the thermal energy storage materials with solid–liquid phase change. The following four major aspects have been the focus of this overview: the type of materials, heat transfer characteristics followed by methods of thermal conductivity enhancements, and durability. In addition, PCM encapsulation and packaging methods are discussed here.
Overview of Basic Solid–Liquid PCMs Used in Building Envelopes—Packaging Methods, Encapsulation, and Thermal Enhancement
Modern developments in areas of building technologies and new construction methods have led to reduced build time and cost for residential and commercial buildings. However, they have also resulted in lightweight construction materials with very little thermal mass. Fortunately, PCM-enhanced building components exhibit higher per unit heat storage capacity than more traditional building materials and they can bring additional thermal mass to lightweight building structures. In this chapter, an overview has been made of the thermal energy storage materials with solid–liquid phase change. The following four major aspects have been the focus of this overview: the type of materials, heat transfer characteristics followed by methods of thermal conductivity enhancements, and durability. In addition, PCM encapsulation and packaging methods are discussed here.
Overview of Basic Solid–Liquid PCMs Used in Building Envelopes—Packaging Methods, Encapsulation, and Thermal Enhancement
Engineering Materials,Processes
Kośny, Jan (Autor:in)
08.05.2015
45 pages
Aufsatz/Kapitel (Buch)
Elektronische Ressource
Englisch
| Springer Verlag | 2020
| British Library Online Contents | 2013
| British Library Conference Proceedings | 2013
Thermal testing of building envelopes
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| British Library Online Contents | 2013