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Thermal and Energy Modeling of PCM-Enhanced Building Envelopes
Energy storage in building envelopes can be accomplished by means of sensible and latent heat accumulation. A large number of numerical tools enabling thermal and energy performance analysis of building envelopes containing PCM have been already developed. They now successfully support numerical optimization of thermal characteristics for building technologies utilizing latent heat storage. At the same time, reliable whole building energy models can numerically facilitate an optimized design of the PCM enhanced building components without the need for time-consuming and expensive whole-building field experiments. This chapter offers a review of the best-known numerical methods useful for the performance analysis of PCM-enhanced building envelopes. It also presents a selection of the most popular computer programs useful for system-scale thermal analysis and several best-known whole building energy simulation tools.
Thermal and Energy Modeling of PCM-Enhanced Building Envelopes
Energy storage in building envelopes can be accomplished by means of sensible and latent heat accumulation. A large number of numerical tools enabling thermal and energy performance analysis of building envelopes containing PCM have been already developed. They now successfully support numerical optimization of thermal characteristics for building technologies utilizing latent heat storage. At the same time, reliable whole building energy models can numerically facilitate an optimized design of the PCM enhanced building components without the need for time-consuming and expensive whole-building field experiments. This chapter offers a review of the best-known numerical methods useful for the performance analysis of PCM-enhanced building envelopes. It also presents a selection of the most popular computer programs useful for system-scale thermal analysis and several best-known whole building energy simulation tools.
Thermal and Energy Modeling of PCM-Enhanced Building Envelopes
Engineering Materials,Processes
Kośny, Jan (Autor:in)
08.05.2015
68 pages
Aufsatz/Kapitel (Buch)
Elektronische Ressource
Englisch
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