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Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Study on the grindability and removal mechanism of high volume fraction SiCp/Al composites based on single diamond grain grinding
https://orcid.org/http://orcid.org/0009-0007-5729-6518
In comparison to silicon carbide particle-reinforced aluminum matrix composites (SiCp/Al composites) with low volume fractions, those with higher volume fractions exhibit superior mechanical properties, thermal stability, and wear resistance. However, the dense distribution of hard SiC particles significantly increase the resistance to machining, thereby deteriorating the surface/subsurface quality after processing. This paper employs 3D grinding simulation and single diamond grain grinding experiments to investigate the removal mechanism and the surface/subsurface quality of SiCp/Al composites with a volume fraction of 55%. It analyzes the typical removal processes and the damage to the surface/subsurface by combining stress and grinding force variations, explores the conditions for plastic removal of SiC particles, and elucidates the formation mechanisms of different chip morphologies. The results show that the removal process of SiCp/Al composites comprises five stages: plastic removal of the Al matrix, plastic removal of SiC particles, initiation of cracks in SiC particles, internal crack propagation within SiC particles, and brittle fracture of SiC particles. Moreover, it was observed that the stress magnitude and grinding force fluctuation during the grinding of SiC particles are significantly higher than those during the grinding of the aluminum matrix. Additionally, as the grinding depth (ap) increases, more cracks appear in SiC particles, with some cracks even penetrating through the entire particle. Further increase in ap leads to the coalescence of numerous cracks, forming pits and consequently fracturing the SiC particles.
Study on the grindability and removal mechanism of high volume fraction SiCp/Al composites based on single diamond grain grinding
https://orcid.org/http://orcid.org/0009-0007-5729-6518
In comparison to silicon carbide particle-reinforced aluminum matrix composites (SiCp/Al composites) with low volume fractions, those with higher volume fractions exhibit superior mechanical properties, thermal stability, and wear resistance. However, the dense distribution of hard SiC particles significantly increase the resistance to machining, thereby deteriorating the surface/subsurface quality after processing. This paper employs 3D grinding simulation and single diamond grain grinding experiments to investigate the removal mechanism and the surface/subsurface quality of SiCp/Al composites with a volume fraction of 55%. It analyzes the typical removal processes and the damage to the surface/subsurface by combining stress and grinding force variations, explores the conditions for plastic removal of SiC particles, and elucidates the formation mechanisms of different chip morphologies. The results show that the removal process of SiCp/Al composites comprises five stages: plastic removal of the Al matrix, plastic removal of SiC particles, initiation of cracks in SiC particles, internal crack propagation within SiC particles, and brittle fracture of SiC particles. Moreover, it was observed that the stress magnitude and grinding force fluctuation during the grinding of SiC particles are significantly higher than those during the grinding of the aluminum matrix. Additionally, as the grinding depth (ap) increases, more cracks appear in SiC particles, with some cracks even penetrating through the entire particle. Further increase in ap leads to the coalescence of numerous cracks, forming pits and consequently fracturing the SiC particles.
Study on the grindability and removal mechanism of high volume fraction SiCp/Al composites based on single diamond grain grinding
https://orcid.org/http://orcid.org/0009-0007-5729-6518
In comparison to silicon carbide particle-reinforced aluminum matrix composites (SiCp/Al composites) with low volume fractions, those with higher volume fractions exhibit superior mechanical properties, thermal stability, and wear resistance. However, the dense distribution of hard SiC particles significantly increase the resistance to machining, thereby deteriorating the surface/subsurface quality after processing. This paper employs 3D grinding simulation and single diamond grain grinding experiments to investigate the removal mechanism and the surface/subsurface quality of SiCp/Al composites with a volume fraction of 55%. It analyzes the typical removal processes and the damage to the surface/subsurface by combining stress and grinding force variations, explores the conditions for plastic removal of SiC particles, and elucidates the formation mechanisms of different chip morphologies. The results show that the removal process of SiCp/Al composites comprises five stages: plastic removal of the Al matrix, plastic removal of SiC particles, initiation of cracks in SiC particles, internal crack propagation within SiC particles, and brittle fracture of SiC particles. Moreover, it was observed that the stress magnitude and grinding force fluctuation during the grinding of SiC particles are significantly higher than those during the grinding of the aluminum matrix. Additionally, as the grinding depth (ap) increases, more cracks appear in SiC particles, with some cracks even penetrating through the entire particle. Further increase in ap leads to the coalescence of numerous cracks, forming pits and consequently fracturing the SiC particles.
Study on the grindability and removal mechanism of high volume fraction SiCp/Al composites based on single diamond grain grinding
Arch. Civ. Mech. Eng.
Yin, Guoqiang (Autor:in) / Liang, Hongrui (Autor:in) / Wang, Dong (Autor:in) / Liu, Zeyu (Autor:in) / Zhou, Yunguang (Autor:in)
03.08.2024
Aufsatz (Zeitschrift)
Elektronische Ressource
Englisch
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