Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Silicon Microchannel Cooling for High Power Chips
In this work, single-phase Si microchannel coolers have been designed and characterized for cooling very high power density chips in single-chip modules (SCMs) in a laboratory environment. The average heat transfer coefficient was determined for a wide range of microchannel designs. Through the use of multiple heat exchanger zones and optimized cooler fin design, an average unit thermal resistance of 16.2°C·mm2/W between the chip surface and the inlet cooling water was demonstrated for an Si microchannel cooler attached to a chip with Ag epoxy in an SCM. Very good uniformity from SCM to SCM (±2%) and within an SCM (±5%) was achieved. Further, cooling of a thermal test chip with a microchannel cooler bonded to it and packaged in an SCM was also demonstrated for a chip power density greater than 400 W/cm2. Coolers of this design should be able to cool chips with average power densities of 500 W/cm2 or more.
Silicon Microchannel Cooling for High Power Chips
In this work, single-phase Si microchannel coolers have been designed and characterized for cooling very high power density chips in single-chip modules (SCMs) in a laboratory environment. The average heat transfer coefficient was determined for a wide range of microchannel designs. Through the use of multiple heat exchanger zones and optimized cooler fin design, an average unit thermal resistance of 16.2°C·mm2/W between the chip surface and the inlet cooling water was demonstrated for an Si microchannel cooler attached to a chip with Ag epoxy in an SCM. Very good uniformity from SCM to SCM (±2%) and within an SCM (±5%) was achieved. Further, cooling of a thermal test chip with a microchannel cooler bonded to it and packaged in an SCM was also demonstrated for a chip power density greater than 400 W/cm2. Coolers of this design should be able to cool chips with average power densities of 500 W/cm2 or more.
Silicon Microchannel Cooling for High Power Chips
Colgan, Evan G. (Autor:in) / Furman, Bruce (Autor:in) / Gaynes, Mike (Autor:in) / LaBianca, Nancy (Autor:in) / Magerlein, John (Autor:in) / Polastre, Robert (Autor:in) / Bezama, R. J. (Autor:in) / Choudhary, Rehan (Autor:in) / Marston, Ken (Autor:in) / Toy, Hilton (Autor:in)
HVAC&R Research ; 12 ; 1031-1045
01.10.2006
15 pages
Aufsatz (Zeitschrift)
Elektronische Ressource
Unbekannt
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