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Reduction of Airborne Molecular Contamination from fab construction materials
Specific organic and inorganic contaminants are detrimental to wafer manufacturing. Testing of materials and choice of alternatives or product formulation can reduce or eliminate these compounds and specific sources of airborne molecular contamination in the cleanroom. A new test method for semiconductor industry was developed to identify and quantify organic contaminants at low detection levels. This method is referred to as dynamic headspace-thermal desorption/gas chromatography-mass spectrometry.
Reduction of Airborne Molecular Contamination from fab construction materials
Specific organic and inorganic contaminants are detrimental to wafer manufacturing. Testing of materials and choice of alternatives or product formulation can reduce or eliminate these compounds and specific sources of airborne molecular contamination in the cleanroom. A new test method for semiconductor industry was developed to identify and quantify organic contaminants at low detection levels. This method is referred to as dynamic headspace-thermal desorption/gas chromatography-mass spectrometry.
Reduction of Airborne Molecular Contamination from fab construction materials
Gutowski, T. (Autor:in) / Oikawa, H. (Autor:in) / Kobayashi, S. (Autor:in)
1997
6 Seiten, 10 Quellen
Aufsatz (Konferenz)
Englisch
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