Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Discuss of Bonding Mechanism of Al-Phosphate No-Bake Sand
Adding B-ion additive or Mg-ion additive to Al-phosphate binder to get different binders, and viscosity of Al-phosphate binders and dry strength of their no-bake sand were tested, bonding mechanism among sands of Al-phosphate no-bake sand was discussed by SEM and EDS. Results indicate that Mg-ion additive can increase binder’s viscosity and dry strength of its no-bake sand more obviously than B-ion additive, adding Mg-ion additive and B-ion additive simultaneously is more obvious. Location crack produced is changed from sand surface to binding bridge inner while adding Mg-ion additive and B-ion additive simultaneously ,and fracture mode is changed from adhesive fracture mainly to cohesive fracture mainly, dry strength is improved from 0.86MPa to 2.38MPa.
Discuss of Bonding Mechanism of Al-Phosphate No-Bake Sand
Adding B-ion additive or Mg-ion additive to Al-phosphate binder to get different binders, and viscosity of Al-phosphate binders and dry strength of their no-bake sand were tested, bonding mechanism among sands of Al-phosphate no-bake sand was discussed by SEM and EDS. Results indicate that Mg-ion additive can increase binder’s viscosity and dry strength of its no-bake sand more obviously than B-ion additive, adding Mg-ion additive and B-ion additive simultaneously is more obvious. Location crack produced is changed from sand surface to binding bridge inner while adding Mg-ion additive and B-ion additive simultaneously ,and fracture mode is changed from adhesive fracture mainly to cohesive fracture mainly, dry strength is improved from 0.86MPa to 2.38MPa.
Discuss of Bonding Mechanism of Al-Phosphate No-Bake Sand
Advanced Materials Research ; 472-475 ; 605-608
27.02.2012
4 pages
Aufsatz (Zeitschrift)
Elektronische Ressource
Englisch
Discuss of Bonding Mechanism of Al-Phosphate No-Bake Sand
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