Multimodal Electronic Skin: Fingerpad‐Inspired Multimodal Electronic Skin for Material Discrimination and Texture Recognition (Adv. Sci. 9/2021): Fid-Bau Portal

Multimodal Electronic Skin: Fingerpad‐Inspired Multimodal Electronic Skin for Material Discrimination and Texture Recognition (Adv. Sci. 9/2021)

Lee, Giwon / Son, Jong Hyun / Lee, Siyoung / Kim, Seong Won / Kim, Daegun / Nguyen, Nguyen Ngan / Lee, Seung Goo / Cho, Kilwon

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Multimodal Electronic Skin: Fingerpad‐Inspired Multimodal Electronic Skin for Material Discrimination and Texture Recognition (Adv. Sci. 9/2021)

Lee, Giwon / Son, Jong Hyun / Lee, Siyoung / Kim, Seong Won / Kim, Daegun / Nguyen, Nguyen Ngan / Lee, Seung Goo / Cho, Kilwon

Multimodal Electronic Skin: Fingerpad‐Inspired Multimodal Electronic Skin for Material Discrimination and Texture Recognition (Adv. Sci. 9/2021)

Lee, Giwon / Son, Jong Hyun / Lee, Siyoung / Kim, Seong Won / Kim, Daegun / Nguyen, Nguyen Ngan / Lee, Seung Goo / Cho, Kilwon

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Titel:

Multimodal Electronic Skin: Fingerpad‐Inspired Multimodal Electronic Skin for Material Discrimination and Texture Recognition (Adv. Sci. 9/2021)

Beteiligte:

Lee, Giwon (Autor:in) / Son, Jong Hyun (Autor:in) / Lee, Siyoung (Autor:in) / Kim, Seong Won (Autor:in) / Kim, Daegun (Autor:in) / Nguyen, Nguyen Ngan (Autor:in) / Lee, Seung Goo (Autor:in) / Cho, Kilwon (Autor:in)

Erschienen in:

Advanced Science ; 8

Erscheinungsdatum:

01.05.2021

Format / Umfang:

1 pages

ISSN:

2198-3844

DOI:

https://doi.org/10.1002/advs.202170047

Medientyp:

Aufsatz (Zeitschrift)

Format:

Elektronische Ressource

Sprache:

Englisch

Lee, Giwon / Son, Jong Hyun / Lee, Siyoung et al. | Wiley | 2021

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