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Microscopic Analysis of Dynamic Loading‐induced Fractures by Using Micro CT
The purpose of this study is to reveal the mechanism of the high‐voltage electric pulsed test. The artificial samples were tested by the high‐voltage electric pulsed test. To estimate the current path and analyze the fractures at grain boundaries, the samples were observed by using Micro CT, before and after the test. The fracture patterns were divided into 2 types, being the “multi fracture pattern” and the “single fracture pattern”.
Microscopic Analysis of Dynamic Loading‐induced Fractures by Using Micro CT
The purpose of this study is to reveal the mechanism of the high‐voltage electric pulsed test. The artificial samples were tested by the high‐voltage electric pulsed test. To estimate the current path and analyze the fractures at grain boundaries, the samples were observed by using Micro CT, before and after the test. The fracture patterns were divided into 2 types, being the “multi fracture pattern” and the “single fracture pattern”.
Microscopic Analysis of Dynamic Loading‐induced Fractures by Using Micro CT
Desrues, Jacques (Herausgeber:in) / Viggiani, Gioacchino (Herausgeber:in) / Bésuelle, Pierre (Herausgeber:in) / Yokota, Mitsuhiro (Autor:in) / Cho, S. H. (Autor:in) / Ito, M. (Autor:in) / Owada, S. (Autor:in) / Kaneko, K. (Autor:in)
01.01.2006
7 pages
Aufsatz/Kapitel (Buch)
Elektronische Ressource
Englisch
Microscopic Analysis of Dynamic Loading-induced Fractures by Using Micro CT
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