A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Magnetostrictive wire-bonding clamp for semiconductor packaging: initial prototype design, modeling, and experiments [3326-59]
Magnetostrictive wire-bonding clamp for semiconductor packaging: initial prototype design, modeling, and experiments [3326-59]
Magnetostrictive wire-bonding clamp for semiconductor packaging: initial prototype design, modeling, and experiments [3326-59]
Dozor, D. M. (author) / Sater, J. M. / SPIE
Conference, Industrial and commercial applications of smart structures technologies ; 1998 ; San Diego; CA
1998-01-01
11 pages
Held as part of smart structures and materials 1998
Conference paper
English
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