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Tensile Creep Behavior of HPC at Early Ages under Different Curing Temperatures

Yang, Y. / Li, P. / Wu, Y.P.

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Tensile Creep Behavior of HPC at Early Ages under Different Curing Temperatures

Yang, Y. / Li, P. / Wu, Y.P.

Tensile Creep Behavior of HPC at Early Ages under Different Curing Temperatures

Yang, Y. / Li, P. / Wu, Y.P.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Tensile Creep Behavior of HPC at Early Ages under Different Curing Temperatures

Contributors:

Yang, Y. (author) / Li, P. (author) / Wu, Y.P. (author) / Li, G.

Conference:

Conference, Advanced building materials ; 2011 ; Haikou, China

Published in:

Advanced building materials ; 434-439

ADVANCED MATERIALS RESEARCH -ZUG- ; 250/253

Publication date:

2011-01-01

Size:

6 pages

Remarks:

Includes bibliographical references and index

ISBN:

9783037851272

ISSN:

1022-6680

Type of media:

Conference paper

Type of material:

Language:

English

Keywords:

Technology , Engineering , Engineering materials , Energy , Management , Control , Information technology

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