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Adhesion improvement of copper/epoxy joints

Yun, H. K. / Cho, K. / An, J. H. / Park, C. E.

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Adhesion improvement of copper/epoxy joints

Yun, H. K. / Cho, K. / An, J. H. / Park, C. E.

Adhesion improvement of copper/epoxy joints

Yun, H. K. / Cho, K. / An, J. H. / Park, C. E.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Adhesion improvement of copper/epoxy joints

Contributors:

Yun, H. K. (author) / Cho, K. (author) / An, J. H. (author) / Park, C. E. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 27 ; 5811

Publication date:

1992-01-01

Size:

5811 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.11

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