Fabrication of via-holes in multi-chip module using third harmonic generation of Nd:YAG laser: Fid-Bau Portal

Fabrication of via-holes in multi-chip module using third harmonic generation of Nd:YAG laser

Gofuku, E. / Ohnawa, T. / Takada, M. / Matsukawa, F.

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Fabrication of via-holes in multi-chip module using third harmonic generation of Nd:YAG laser

Gofuku, E. / Ohnawa, T. / Takada, M. / Matsukawa, F.

Fabrication of via-holes in multi-chip module using third harmonic generation of Nd:YAG laser

Gofuku, E. / Ohnawa, T. / Takada, M. / Matsukawa, F.

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Document information

Title:

Fabrication of via-holes in multi-chip module using third harmonic generation of Nd:YAG laser

Contributors:

Gofuku, E. (author) / Ohnawa, T. (author) / Takada, M. (author) / Matsukawa, F. (author)

Published in:

APPLIED SURFACE SCIENCE ; 64 ; 353

Publication date:

1993-01-01

Size:

353 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 621.35

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