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    Optimization of Ultrasonic Copper Electro-deposition in the Narrow Channels of Via-Hole in Integrated Circuits

    New search for: Seryanov, Y. V.
    New search for: Kvyatkovskaya, L. M.
    New search for: Grishanin, V. A.

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    Optimization of Ultrasonic Copper Electro-deposition in the Narrow Channels of Via-Hole in Integrated Circuits

    New search for: Seryanov, Y. V.
    New search for: Kvyatkovskaya, L. M.
    New search for: Grishanin, V. A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Optimization of Ultrasonic Copper Electro-deposition in the Narrow Channels of Via-Hole in Integrated Circuits

    New search for: Seryanov, Y. V.
    New search for: Kvyatkovskaya, L. M.
    New search for: Grishanin, V. A.

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Title:

    Optimization of Ultrasonic Copper Electro-deposition in the Narrow Channels of Via-Hole in Integrated Circuits

    Contributors:

    Seryanov, Y. V. (author) / Kvyatkovskaya, L. M. (author) / Grishanin, V. A. (author)

    Published in:

    PROTECTION OF METALS -NEW YORK- C/C OF ZASHCHITA METALLOV ; 30 ; 284

    Publication date:

    1994-01-01

    Size:

    284 pages

    ISSN:

    0033-1732

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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