The deposition and adhesion of copper films on smooth polymer surfaces: Fid-Bau Portal

The deposition and adhesion of copper films on smooth polymer surfaces

Eisch, J. J. / Laskowski, J. / Bielinski, J. / Boleslawski, M. P.

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The deposition and adhesion of copper films on smooth polymer surfaces

Eisch, J. J. / Laskowski, J. / Bielinski, J. / Boleslawski, M. P.

The deposition and adhesion of copper films on smooth polymer surfaces

Eisch, J. J. / Laskowski, J. / Bielinski, J. / Boleslawski, M. P.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

The deposition and adhesion of copper films on smooth polymer surfaces

Contributors:

Eisch, J. J. (author) / Laskowski, J. (author) / Bielinski, J. (author) / Boleslawski, M. P. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE LETTERS ; 14 ; 146

Publication date:

1995-01-01

Size:

146 pages

ISSN:

0261-8028

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.11

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