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    Thermal stress intensity factors for partially insulated interface crack under uniform heat flow

    New search for: Kang Yong Lee
    New search for: Park, S.-J.

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    Thermal stress intensity factors for partially insulated interface crack under uniform heat flow

    New search for: Kang Yong Lee
    New search for: Park, S.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermal stress intensity factors for partially insulated interface crack under uniform heat flow

    New search for: Kang Yong Lee
    New search for: Park, S.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Thermal stress intensity factors for partially insulated interface crack under uniform heat flow

    Contributors:

    Kang Yong Lee (author) / Park, S.-J. (author)

    Published in:

    ENGINEERING FRACTURE MECHANICS ; 50 ; 475

    Publication date:

    1995-01-01

    Size:

    475 pages

    ISSN:

    0013-7944

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1 / 126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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