Determination of Organic Additives in Copper Plating Electrolytes by Cyclic Voltammetry: Fid-Bau Portal

Determination of Organic Additives in Copper Plating Electrolytes by Cyclic Voltammetry

Rysev, A. P. / Igumnov, M. S.

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Determination of Organic Additives in Copper Plating Electrolytes by Cyclic Voltammetry

Rysev, A. P. / Igumnov, M. S.

Determination of Organic Additives in Copper Plating Electrolytes by Cyclic Voltammetry

Rysev, A. P. / Igumnov, M. S.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Determination of Organic Additives in Copper Plating Electrolytes by Cyclic Voltammetry

Contributors:

Rysev, A. P. (author) / Igumnov, M. S. (author)

Published in:

INDUSTRIAL LABORATORY C/C OF ZAVODSKAIA LABORATORIIA ; 61 ; 1

Publication date:

1995-01-01

Size:

1 pages

ISSN:

0019-8447

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 607.2

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