Intergranular/transgranular fatigue of copper: influence of environment on crack path and propagation rates: Fid-Bau Portal

Intergranular/transgranular fatigue of copper: influence of environment on crack path and propagation rates

Tromans, D. / Sun, R.-H.

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Intergranular/transgranular fatigue of copper: influence of environment on crack path and propagation rates

Tromans, D. / Sun, R.-H.

Intergranular/transgranular fatigue of copper: influence of environment on crack path and propagation rates

Tromans, D. / Sun, R.-H.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Intergranular/transgranular fatigue of copper: influence of environment on crack path and propagation rates

Contributors:

Tromans, D. (author) / Sun, R.-H. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 219 ; 56-65

Publication date:

1996-01-01

Size:

10 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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