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Joining of AlN to Cu using In-base active brazing fillers

Huh, D. / Kim, D.-H.

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Joining of AlN to Cu using In-base active brazing fillers

Huh, D. / Kim, D.-H.

Joining of AlN to Cu using In-base active brazing fillers

Huh, D. / Kim, D.-H.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

Similar titles

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Document information

Title:

Joining of AlN to Cu using In-base active brazing fillers

Contributors:

Huh, D. (author) / Kim, D.-H. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 12 ; 1048-1055

Publication date:

1997-01-01

Size:

8 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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