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Sensitivity of piezoelectric wafers to the curing of thermoset resins and thermoset composites
Sensitivity of piezoelectric wafers to the curing of thermoset resins and thermoset composites
Sensitivity of piezoelectric wafers to the curing of thermoset resins and thermoset composites
Wang, X. (author) / Ehlers, C. (author) / Kissinger, C. (author) / Neitzel, M. (author) / Ye, L. (author) / Mai, Y.-M. (author)
SMART MATERIALS AND STRUCTURES ; 7 ; 113-120
1998-01-01
8 pages
Article (Journal)
English
DDC:
530
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