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    Analysis of thermal and athermal deformation mechanisms during creep of gamma-TiAl alloys

    New search for: Morris, M. A.
    New search for: Leboeuf, M.
    New search for: Herman, H.
    New search for: Pope, D. P.
    New search for: Liu, C. T.
    New search for: Whang, S. H.
    New search for: Yamaguchi, M.

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    Analysis of thermal and athermal deformation mechanisms during creep of gamma-TiAl alloys

    New search for: Morris, M. A.
    New search for: Leboeuf, M.
    New search for: Herman, H.
    New search for: Pope, D. P.
    New search for: Liu, C. T.
    New search for: Whang, S. H.
    New search for: Yamaguchi, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Analysis of thermal and athermal deformation mechanisms during creep of gamma-TiAl alloys

    New search for: Morris, M. A.
    New search for: Leboeuf, M.
    New search for: Herman, H.
    New search for: Pope, D. P.
    New search for: Liu, C. T.
    New search for: Whang, S. H.
    New search for: Yamaguchi, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Analysis of thermal and athermal deformation mechanisms during creep of gamma-TiAl alloys

    Contributors:

    Morris, M. A. (author) / Leboeuf, M. (author) / Herman, H. / Pope, D. P. / Liu, C. T. / Whang, S. H. / Yamaguchi, M.

    Published in:

    Structural Materials: Properties, Microstructure and Processing: High Temperature Intermetallics ; 429-437

    MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 239/240

    Publication date:

    1997-01-01

    Size:

    9 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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