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Grain boundary effects on the fatigue deformation and cracking behaviour of copper bicrystals

Hu, Y. M. / Wang, Z. G.

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Grain boundary effects on the fatigue deformation and cracking behaviour of copper bicrystals

Hu, Y. M. / Wang, Z. G.

Grain boundary effects on the fatigue deformation and cracking behaviour of copper bicrystals

Hu, Y. M. / Wang, Z. G.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Grain boundary effects on the fatigue deformation and cracking behaviour of copper bicrystals

Contributors:

Hu, Y. M. (author) / Wang, Z. G. (author)

Published in:

INTERNATIONAL JOURNAL OF FATIGUE ; 20 ; 463-470

Publication date:

1998-01-01

Size:

8 pages

ISSN:

0142-1123

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1126

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