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    Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints - Part 1: Substrate influence on TTT and CHT curing diagrams of wood adhesives

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    New search for: Pizzi, A.

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    Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints - Part 1: Substrate influence on TTT and CHT curing diagrams of wood adhesives

    New search for: Lu, X.
    New search for: Pizzi, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints - Part 1: Substrate influence on TTT and CHT curing diagrams of wood adhesives

    New search for: Lu, X.
    New search for: Pizzi, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints - Part 1: Substrate influence on TTT and CHT curing diagrams of wood adhesives

    Contributors:

    Lu, X. (author) / Pizzi, A. (author)

    Published in:

    HOLZ ALS ROH UND WERKSTOFF ; 56 ; 339-346

    Publication date:

    1998-01-01

    Size:

    8 pages

    ISSN:

    0018-3768

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.12

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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