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A platform for research: civil engineering, architecture and urbanism
On machining rate of hydrodynamic polishing process under semi-contact lubricating condition
On machining rate of hydrodynamic polishing process under semi-contact lubricating condition
On machining rate of hydrodynamic polishing process under semi-contact lubricating condition
Su, Y.-T. (author) / Hung, T.-C. (author) / Chang, Y.-Y. (author)
WEAR -LAUSANNE- ; 220 ; 22-33
1998-01-01
12 pages
Article (Journal)
English
DDC:
620.11292
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