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Development of Metallized Aluminum Nitride for Low Temperature Sintering of Electronic Packages
Development of Metallized Aluminum Nitride for Low Temperature Sintering of Electronic Packages
Development of Metallized Aluminum Nitride for Low Temperature Sintering of Electronic Packages
ADVANCING MICROELECTRONICS ; 21 ; 29-30
1994-01-01
2 pages
Article (Journal)
English
DDC:
621.381
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