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Bound Solution for Residual Stress Due to Thermal Mismatch in Particle Reinforced Composites

Park, S. J. / Earmme, Y. Y.

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Bound Solution for Residual Stress Due to Thermal Mismatch in Particle Reinforced Composites

Park, S. J. / Earmme, Y. Y.

Bound Solution for Residual Stress Due to Thermal Mismatch in Particle Reinforced Composites

Park, S. J. / Earmme, Y. Y.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Bound Solution for Residual Stress Due to Thermal Mismatch in Particle Reinforced Composites

Contributors:

Park, S. J. (author) / Earmme, Y. Y. (author)

Published in:

JOURNAL OF COMPOSITE MATERIALS ; 33 ; 1205-1221

Publication date:

1999-01-01

Size:

17 pages

ISSN:

0021-9983

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.118

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