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    Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites

    New search for: Jedamzik, R.
    New search for: Neubrand, A.
    New search for: Rodel, J.

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    Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites

    New search for: Jedamzik, R.
    New search for: Neubrand, A.
    New search for: Rodel, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites

    New search for: Jedamzik, R.
    New search for: Neubrand, A.
    New search for: Rodel, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites

    Contributors:

    Jedamzik, R. (author) / Neubrand, A. (author) / Rodel, J. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 35 ; 477-486

    Publication date:

    2000-01-01

    Size:

    10 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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