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Crack Problems for Functionally Graded Materials Under Transient Thermal Loading
Crack Problems for Functionally Graded Materials Under Transient Thermal Loading
Crack Problems for Functionally Graded Materials Under Transient Thermal Loading
Wang, B. L. (author) / Han, J. C. (author) / Du, S. Y. (author)
JOURNAL OF THERMAL STRESSES ; 23 ; 143-168
2000-01-01
26 pages
Article (Journal)
English
DDC:
620.1121
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