Relative Damage Stress: Dominant Mechanical Factor for the Failure of Soldered Joints under Temperature Cycling: Fid-Bau Portal

Relative Damage Stress: Dominant Mechanical Factor for the Failure of Soldered Joints under Temperature Cycling

Ma, X. / Qian, Y. / Fang, H. / Yoshida, F.

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Relative Damage Stress: Dominant Mechanical Factor for the Failure of Soldered Joints under Temperature Cycling

Ma, X. / Qian, Y. / Fang, H. / Yoshida, F.

Relative Damage Stress: Dominant Mechanical Factor for the Failure of Soldered Joints under Temperature Cycling

Ma, X. / Qian, Y. / Fang, H. / Yoshida, F.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Relative Damage Stress: Dominant Mechanical Factor for the Failure of Soldered Joints under Temperature Cycling

Contributors:

Ma, X. (author) / Qian, Y. (author) / Fang, H. (author) / Yoshida, F. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 17 ; 193-194

Publication date:

2001-01-01

Size:

2 pages

ISSN:

1005-0302

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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