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    Grain boundary crack growth in interconnects with an electric current

    New search for: Liu, C. Y.
    New search for: Lee, S.
    New search for: Chuang, T. j.

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    Grain boundary crack growth in interconnects with an electric current

    New search for: Liu, C. Y.
    New search for: Lee, S.
    New search for: Chuang, T. j.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Grain boundary crack growth in interconnects with an electric current

    New search for: Liu, C. Y.
    New search for: Lee, S.
    New search for: Chuang, T. j.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Grain boundary crack growth in interconnects with an electric current

    Contributors:

    Liu, C. Y. (author) / Lee, S. (author) / Chuang, T. j. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 86 ; 101 - 108

    Publication date:

    2001-01-01

    Size:

    8 pages

    ISSN:

    0921-5107

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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