Localization of dissolution with thick insulating masks in conditions of electrochemical micromachining of copper in nitrate solutions: Fid-Bau Portal

Localization of dissolution with thick insulating masks in conditions of electrochemical micromachining of copper in nitrate solutions

Redkozubov, O. O. / Keloglu, O. Y. / Yushchenko, S. P. / Dikusar, A. I.

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Localization of dissolution with thick insulating masks in conditions of electrochemical micromachining of copper in nitrate solutions

Redkozubov, O. O. / Keloglu, O. Y. / Yushchenko, S. P. / Dikusar, A. I.

Localization of dissolution with thick insulating masks in conditions of electrochemical micromachining of copper in nitrate solutions

Redkozubov, O. O. / Keloglu, O. Y. / Yushchenko, S. P. / Dikusar, A. I.

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Title:

Localization of dissolution with thick insulating masks in conditions of electrochemical micromachining of copper in nitrate solutions

Contributors:

Redkozubov, O. O. (author) / Keloglu, O. Y. (author) / Yushchenko, S. P. (author) / Dikusar, A. I. (author)

Published in:

SURFACE ENGINEERING AND APPLIED ELECTROCHEMISTRY C/C OF ELEKTRONNAIA OBRABOTKA MATERIALOV ; 1-16

Publication date:

1999-01-01

Size:

16 pages

ISSN:

1068-3755

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.44 / 660.297

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Anodic treatment of strengthening the electrochemical coatings in electrolytes for electrochemical machining: 1. Micromachining of CoW coatings in nitrate and nitrate-alkaline solutions

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