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    Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging

    New search for: Wang, Y.
    New search for: Zhang, G.
    New search for: Ma, J.

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    Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging

    New search for: Wang, Y.
    New search for: Zhang, G.
    New search for: Ma, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging

    New search for: Wang, Y.
    New search for: Zhang, G.
    New search for: Ma, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging

    Contributors:

    Wang, Y. (author) / Zhang, G. (author) / Ma, J. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 94 ; 48 - 53

    Publication date:

    2002-01-01

    Size:

    6 pages

    ISSN:

    0921-5107

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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