Copper Electroplating from Vanadate- and Molybdate-Containing Electrolytes with Suspended Titanium Dioxide: Fid-Bau Portal

Copper Electroplating from Vanadate- and Molybdate-Containing Electrolytes with Suspended Titanium Dioxide

Saifullin, R. S. / Fomina, R. E. / Mingazova, G. G. / Khaidarov, R. A.

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Copper Electroplating from Vanadate- and Molybdate-Containing Electrolytes with Suspended Titanium Dioxide

Saifullin, R. S. / Fomina, R. E. / Mingazova, G. G. / Khaidarov, R. A.

Copper Electroplating from Vanadate- and Molybdate-Containing Electrolytes with Suspended Titanium Dioxide

Saifullin, R. S. / Fomina, R. E. / Mingazova, G. G. / Khaidarov, R. A.

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Title:

Copper Electroplating from Vanadate- and Molybdate-Containing Electrolytes with Suspended Titanium Dioxide

Contributors:

Saifullin, R. S. (author) / Fomina, R. E. (author) / Mingazova, G. G. (author) / Khaidarov, R. A. (author)

Published in:

PROTECTION OF METALS -NEW YORK- C/C OF ZASHCHITA METALLOV ; 38 ; 471-474

Publication date:

2002-01-01

Size:

4 pages

ISSN:

0033-1732

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669

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