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Condition Optimizing of Electroless Copper Plating for Glass Fiber

Zhang, H.-t. / Chen, L.-y. / Wang, Y.-l.

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Condition Optimizing of Electroless Copper Plating for Glass Fiber

Zhang, H.-t. / Chen, L.-y. / Wang, Y.-l.

Condition Optimizing of Electroless Copper Plating for Glass Fiber

Zhang, H.-t. / Chen, L.-y. / Wang, Y.-l.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Condition Optimizing of Electroless Copper Plating for Glass Fiber

Contributors:

Zhang, H.-t. (author) / Chen, L.-y. (author) / Wang, Y.-l. (author)

Published in:

MATERIALS PROTECTION -WUHAN- ; 35 ; 50-52

Publication date:

2002-01-01

Size:

3 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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