Electroless deposition of copper onto alumina sub-micronic powders and sintering: Fid-Bau Portal

Electroless deposition of copper onto alumina sub-micronic powders and sintering

Silvain, J. F. / Bobet, J. L. / Heintz, J. M.

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Electroless deposition of copper onto alumina sub-micronic powders and sintering

Silvain, J. F. / Bobet, J. L. / Heintz, J. M.

Electroless deposition of copper onto alumina sub-micronic powders and sintering

Silvain, J. F. / Bobet, J. L. / Heintz, J. M.

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Order at Subito €

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Document information

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Document information

Title:

Electroless deposition of copper onto alumina sub-micronic powders and sintering

Contributors:

Silvain, J. F. (author) / Bobet, J. L. (author) / Heintz, J. M. (author)

Published in:

COMPOSITES PART A ; 33 ; 1387-1390

Publication date:

2002-01-01

Size:

4 pages

ISSN:

1359-835X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.118

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