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Preoxidation of the Cu layer in direct bonding technology

Ning, H. / Ma, J. / Huang, F. / Wang, Y. / Li, Q. / Li, X.

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Preoxidation of the Cu layer in direct bonding technology

Ning, H. / Ma, J. / Huang, F. / Wang, Y. / Li, Q. / Li, X.

Preoxidation of the Cu layer in direct bonding technology

Ning, H. / Ma, J. / Huang, F. / Wang, Y. / Li, Q. / Li, X.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Preoxidation of the Cu layer in direct bonding technology

Contributors:

Ning, H. (author) / Ma, J. (author) / Huang, F. (author) / Wang, Y. (author) / Li, Q. (author) / Li, X. (author)

Published in:

APPLIED SURFACE SCIENCE ; 211 ; 250-258

Publication date:

2003-01-01

Size:

9 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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