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Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnection applications
Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnection applications
Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnection applications
Ackermann, J. (author) / Videlot, C. (author) / Nguyen, T. N. (author) / Wang, L. (author) / Sarro, P. M. (author) / Crawley, D. (author) / Nikolic, K. (author) / Forshaw, M. (author)
APPLIED SURFACE SCIENCE ; 212-213 ; 411-416
2003-01-01
6 pages
Article (Journal)
English
DDC:
621.35
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