A platform for research: civil engineering, architecture and urbanism
Non-Destructive SiC Wafer Evaluation Based on an Optical Stress Technique
Non-Destructive SiC Wafer Evaluation Based on an Optical Stress Technique
Non-Destructive SiC Wafer Evaluation Based on an Optical Stress Technique
Ma, X. (author) / Parker, M. (author) / Ma, Y. (author) / Kubota, T. (author) / Sudarshan, T. S. (author) / Bergman, P. / Janzen, E.
2003-01-01
4 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Residual stress characterization of welded specimens by non-destructive activation technique
British Library Online Contents | 2007
|Non-Destructive Technique for Evaluation of Degradation on Solar Cells
British Library Online Contents | 2015
|Use of non-destructive technique for evaluation of human ligaments
British Library Conference Proceedings | 1995
|Non-Destructive Evaluation of Weld Structure Using Ultrasonic Imaging Technique
British Library Online Contents | 2012
|