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    Copper deposition by Dynamic Chemical Plating

    New search for: Stremsdoerfer, G.
    New search for: Ghanem, F.
    New search for: Saikali, Y.
    New search for: Fares-Karam, A.

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    Copper deposition by Dynamic Chemical Plating

    New search for: Stremsdoerfer, G.
    New search for: Ghanem, F.
    New search for: Saikali, Y.
    New search for: Fares-Karam, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Copper deposition by Dynamic Chemical Plating

    New search for: Stremsdoerfer, G.
    New search for: Ghanem, F.
    New search for: Saikali, Y.
    New search for: Fares-Karam, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Copper deposition by Dynamic Chemical Plating

    Contributors:

    Stremsdoerfer, G. (author) / Ghanem, F. (author) / Saikali, Y. (author) / Fares-Karam, A. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 38 ; 3285-3291

    Publication date:

    2003-01-01

    Size:

    7 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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